A Scratch Intersection Model of Material Removal During Chemical Mechanical Planarization (CMP)

A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP)

Customer Application Brief Electronics Chemical Mechanical Planarization (CMP) Slurry Manufacturing

Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...

Effects of Surface Forces on Material Removal Rate in Chemical Mechanical Planarization

In chemical mechanical planarization, abrasive particles are pushed onto a wafer by a deformable pad. In addition to the pad–particle contact force, surface forces also act between the wafer and the particles. Experimental studies indicate the significance of slurry pH and particle size on the material removal rate MRR . In this work, a model for MRR, including the contact mechanics of multiple...

Direct Measurement of Planarization Length for Copper Chemical Mechanical Planarization Polishing (cmp) Processes Using a Large Pattern Test Mask

We have used a large pattern test mask and a specific arrangement of structures on a wafer for direct measurement of an average planarization length for copper chemical mechanical polishing (CMP) processes. We propose new minimum, maximum, and average planarization length definitions, based on up and down area measurements as a function of trench width. The average planarization length is usefu...

Yield improvement of chemical mechanical planarization processes

Eamkajornsiri, Sutee, "Yield improvement of chemical mechanical planarization processes " (2005). Retrospective Theses and Dissertations. Paper 3043. The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleed-through, substandard margins, and improper alignment can adversely...